Market Overview:

The Global TCB Bonder Market Size Was USD 110.7 Million In 2022 And Market Is Projected To Touch USD 448.4 Million By 2030, Exhibiting CAGR Of 19.1% During The Forecast Period.

Thermo compression bonder is a way to join two wafers together. It is also called diffusion bonding, pressure bonding, hot compression welding, or solid welding. Thermal compression machines use pressure and vacuum to join or weld together semiconductor wafers. The atoms move closer to each other as the crystal lattice vibrates. These atomic contacts hold interfaces together. Surface diffusion, grain boundary diffusion, and bulk diffusion are the three names for the process of diffusion. The idea behind this technology is to quickly raise the temperature and then quickly lower it. This means that the work can be done quickly and with very tight tolerances. These devices can also be set up to work semi-automatically or fully automatically. It does the same thing as wire bonding, but it does it much faster because it doesn't require people or special equipment.

The accuracy of thermo-compression bonding (TCB) is very high. This technology takes advantage of the melting points of different kinds of synthetic fibers to use thermal processing. It joins two bodies together by using heat and mechanical and thermal pressure. It links the PWB and IC packages with metal wires. Due to their high melting point, the wires that connect the ICB and PWB are called tungsten.

TCB bonder is used because there are more and more people who want small, high-density electronic devices. Due to more people wanting advanced packaging and putting their trust in products that are better and more reliable. The complementary metal-oxide-semiconductor (CMOS) industry and vertically integrated devices use thermo-compression bonding. Accelerometers, pressure sensors, Radio Frequency Microelectromechanical Systems (RF MEMS), and gyroscopes are all made with this bonding. It is usually used in situations where reliability is very important.

COVID-19 Impact:

The spread of COVID-19 is already being felt all over the world, and it is having a big effect on the global TCB bonder market. In 2020, COVID-19 hurt the market in a bad way. There were lockdowns in a number of countries. When the pandemic hit all at once, it caused problems for all kinds of businesses. Due to limited production capacities and broken supply chains, it was hard to make devices that use thermal compression. As CMOS, circuits, semiconductors, logic devices, and many more are the main places where these bonders are used, the pandemic had a big effect on the demand for these devices because operations had to stop. Since then, these bonders also stopped being used for a while. This has hurt the demand for TCB bonds because the production lines that were already running were stopped and no new ones were started.

Market Dynamics:

Market Trends:

• Adoption of Non-Conductive Films to Propel Demand

The use of non-conductive films is a trend that could affect the market for TCB bonders around the world (NCFs). As a replacement for liquid underfill materials that are already piled up, non-conductive films have been made. In fine-pitch interconnection, these films were made to stop problems like void trapping and flux residues from happening. For advanced packaging assembly to go faster, the time it takes for thermos compression needs to be cut down. NCFs with faster curing times have been made so that NCFs can cure more completely. This has made the speed of curing go up even though the bonding temperature has stayed the same. Using isothermal bonding with a faster speed of curing has cut the bonding time even more, and there were micro bumping connections between the parts. With these improvements, bonders are likely to be in higher demand because they will be used in more industries.

Driving Factors:

• Use of Thermo-compression in Wire Bonding to Drive Demand

Wire bonding is a big reason for the growth of the TCB bonder market around the world. Thermo-compression is a way to join two bodies together using heat, mechanical pressure, and thermal application. More and more people want high-quality electronic devices that are small and packed with a lot of them. In the semiconductor and microelectronics industries, wire bonding is used to meet the needs of manufacturing. Where companies use it to make custom technological solutions by using high-density electronics. The bonder is used to connect silicon chips and semiconductor devices to make logic devices. It is used to make semiconductors and microelectronics. TCB is also used to make digital circuits, and the market is expected to grow around the world as wire-bonding technologies improve.

• Rising Demand for OSAT to Expand Market Exponentially

Outsourced assembly and test (OSAT) vendors, which package ICs for third parties, use TCB bonders. IC packaging is a package that keeps circuitry from getting damaged. The demand for OSATs is driven by the demand for semiconductors, which in turn drives the demand for TCBs, which are used by OSATs. This is done to lower the cost of making things inside the company. For advanced packaging, they use new ways to connect wires. TCBs are used in advanced packaging to protect and make the devices smarter.

• Increasing Investments by Key Companies in Research and Development

One of the main things driving the growth of the market is that key players are putting more money into developing more advanced wire bonder equipment. Major market players are spending a lot of money on research and development to create advanced wire bonders that can be used for ribbon bonding of hybrid circuits, sensors, automotive power modules, semiconductor devices, and battery packs. Several companies are also starting advanced training courses and setting up process development labs to improve productivity. These labs will be used to develop and improve processes like machine setup and bond quality control. In conclusion, the growth of the market is being helped by the fact that key players are investing more in building advanced wire bonding equipment for a variety of uses. For example, in October 2021, Inseto put money into building a new lab for Wedge Bonder and also started two courses on how to use bonders. Key companies spend a lot of money on research and development, which is a big part of why the market is growing.

Restraints/Challenges:

• High Prices of TCBs to Hamper Market Growth

High prices, for example, can stop people from buying something on the market. The equipment for thermo-compression bonding is expensive, which can lead to high costs for making things inside the company. Also, OSATs can charge a lot for their third-party services, which can stop some companies from buying semiconductors and slow the growth of the market.

• Shortage of Skilled and Trained Personne

A big problem for the industry that makes semiconductors is that there aren't enough skilled and trained people to make and run these complicated machines. This gap is getting bigger because baby boomers are getting older and the world economy is growing faster than ever. Also, when the baby boomers retired, they took with them a lot of deep knowledge. This left a gap in the number of experienced people who were available. Also, younger people tend to be interested in working in the service industry.

A lack of basic skills and knowledge in engineering, math, science, and technology is also a problem today. This is because technical education programs in schools are getting less and less popular. This has had a big effect on the manufacturing sector and will probably slow the growth of the semiconductor market to some degree, which will hurt sales of capital equipment like wire bonder equipment during the forecast period.

• Contamination at the Bonding Interface Affects the Bond Integrity

The contamination at the bonding interface, especially for organic materials like hydrocarbons, is another major thing that slows the growth of the market. Polymer residues, which are a type of contamination, have a big effect on the prototyping stage and cause weak bonds to form. When weak bonds form, the wire bonder in an electrical system works less well, which slows the growth of the market.

Opportunities:

• Development of Advanced Technology Including Automation

The growth of the wire bonder equipment market is mostly due to the development of new technologies, such as automation. With the help of these new technologies, bonders are more productive and take less time to program. Automation also makes it easy to develop processes quickly, which cuts down on the time needed for production, calibration, maintenance, and setting up processes. Automation also makes it easier to make things by letting you program offline to import data from CAD designs. So, the growth of the global wire bonder equipment market is being driven in a big way by the development of new technologies that speed up the production process and cut down on programming time. For example, Palomar Technologies released the 3880 II Die Bonder in September 2021 so that it could be used in a variety of ways, such as tracking, sorting, and inspection, to speed up the automation process. The product is meant to cut programming time by 95% and increase productivity, which will help speed up the growth of the market.

• Emergence of Internet of Things (IoT)

The Internet of Things (IoT) is expected to open up new opportunities for the wire bonder equipment market to grow. IoT devices can't connect microchips to printed circuit boards (PCBs) without the help of wire bonding technology. As a result, as the number of connected devices grows, so should the need for wire bonding equipment to meet the growing need for reliable and efficient connections.

Strategic Development:

• In January 2022 - The first company to sell chips made with copper hybrid bonding will be the American company Advanced Micro Devices. AMD has shown off the first set of chips that use a technology called "hybrid bonding." Hybrid bonding is also being worked on by companies such as Intel and Samsung.
• In February 2021 - ASM Pacific Technology Ltd (ASMPT), which is the world leader in semiconductor solutions, will send out its 250th thermo-compression bonding tool.
• In July 2022 - MRSI released the MRSI-H-HPLD+ wire bonder to help high-power laser manufacturers improve their accuracy, flexibility, and precision.
• In August 2021 - QP Technologies put in two new ultrasonic wire bonders for power (GaN), radio frequency (RF), and mil-spec/aerospace (mil-aero) devices. The new wire bonders can be used for many things, including making small battery modules that are used in cars.

Key Vendors:

Top market players are

• ASMPT (AMICRA)

ASM AMICRA Microtechnologies is a company that sells high-precision equipment for attaching dies. They focus on sub-micron placement precision. It has die and flip chip bonders, chip-on-substrate (CoS) die bonders, wafer inking systems, dispense and test systems, and more. The company sells to high-tech markets like opto, silicon photonics, laser diodes, integrated circuits, automotive sensors, and others.

• K&S

Companies all over Australia use K&S Corporation Limited for transportation, storage, logistics, fuel distribution, and other services. In some parts of Australia, K&S helps customers in the fishing, farming, and retail industries move goods by road, rail, and sea. They also store and distribute fuel. K&S also delivers goods in bulk all over New Zealand.

• Besi

BE Semiconductor Industries NV (Besi) makes, develops, markets, and sells equipment for putting together semiconductors and electronics for companies all over the world. Die-attach equipment, packaging equipment, and plating equipment are all things that the company sells. It also provides spare parts, tools, and customer service after the sale.

• Shibaura

Molding machines and machine tools are the main types of industrial machinery that Shibaura Machine Co., Ltd. makes. The company has a wide range of products, including machines for making semiconductors, printing presses, control valves, precise machinery, industrial robots, and machining centers (MCs).

• SET

Science, Engineering, and Technology (SET) Corporation is a small, privately owned company that was started in 2002 by scientists from the Defense Advanced Research Projects Agency. Its goal is to create and sell "smart" information technologies that help people do hard things.

• Hanmi

Hanmi Pharm. Company Ltd. makes medicines like antibiotics, vitamins, and intestinal tonics. The company also makes soft capsules for other pharmaceutical companies and sells drinks.

Segmentation Analysis:

The market is segmented on the basis of type, product, material, end-user and region.

By Type Outlook:

There are three different kinds of types: manual, semi-automatic, and automatic. In 2022, 43.01% of the market was made up of manual wire bonders. This is because manual bonders allow the sample to be mounted in any orientation and use programmable radiant tool heat. Also, wire bonders that are operated by hand are used a lot for process development and making microelectronic devices. The growth of the market is also being driven by the fact that manual bonders offer the best bond quality, are easy to use, and are reliable. Also, the fact that manually operated wire bonders can control each bond's parameters, have a touch-screen interface, store programs, and work with a wide range of wire diameters is a big part of why the manual segment is growing so quickly.

During the forecast period, automatic wire bonders are expected to have the highest CAGR. This is because improvements in motion control technology have made them better and more reliable. Also, the development of new software makes it easier to move and update programs across multiple systems. This software is widely used in automotive assembly. Automatic wire bonders are also being used more and more in fields like fine-pitch devices, multi-chip modules, chip-on-board, and optoelectronic packaging. As a result, the reasons listed above, such as improvements in technology and software and more people using them in different fields, are likely to increase the demand for automatic wire bonders in the coming years. For example, in September 2020, Palomar Technologies released a fully automatic wire bonder called the Palomar 8100 Wire Bonder. This machine can make looping profiles and ball bumping according to the user's needs. The latest SMART MOTION technology is built into the product so that it can be used by all operators and also make operators more efficient.

• Manual
• Semi-Automatic
• Automatic

By Product:

There are ball bonders, wedge bonders, stud-bump bonders, ultrasonic bonders, thermocompression bonders, and thermosonic bonders in the product segment. In 2022, wedge bonders had the biggest market share because they could make compact hybrids and MCM power connections work better and be more reliable. Also, improvements in technology, such as voice-coil technology, have led to better wire tension, a shorter wire feed path, and better control over the process. Also, wedge bonders can bond with a wide range of ribbon and wire materials, such as aluminum and gold, making them a good choice for environments with a lot of different kinds of materials. So, the main reason why the market is growing is because technology is getting better and wedge bonders are becoming more flexible. For example, in August 2022, Palomar Technologies said that it would give Bay Photonics a Palomar 9000 Wedge Bonder. The product has the most up-to-date voice-coil technology and can be used for many photonic applications, such as high-end solutions for nuclear power stations and unique secure communications in space. This helps the wedge bonders segment grow.

During the forecast period, the CAGR for ball bonders is expected to be the highest. This is because ball bonding is the fastest way to connect wires. The bonders can connect 5 to 12 or more wires per second, which is faster than any other wire bonder. The bonder is also thought to be perfect for fine pitch applications, as well as MCM hybrids, BGA, and wafer level bumping. Because of their high speed, bonders are being used in more and more applications. This is expected to drive the demand for ball bonders during the forecast period.

• Ball Bonder
• Wedge Bonder
• Stud-Bump Bonder
• Ultrasonic Bonder
• Thermocompression Bonder
• Thermosonic Bonder

By Material:

Gold wire, copper wire, aluminum wire, and silver wire are the different kinds of wire in the material segment. Copper wire bonding had the biggest share of the market in 2022 because copper is better at transferring heat and is more stable than other wire bonder materials. Copper wires are also less expensive than gold wires, which helps the market grow even more. Copper wires also have less resistance to current and let a lot of power flow through them. They are also less likely to break from fatigue or stress cracking under a thermomechanical load. Because of this, the fact that copper wires can handle heat better, have low electric resistance, and are inexpensive are all factors that are helping the market grow. For example, TANAKA Denshi Kogyo said in December 2021 that it would open a new plant in Taiwan to make copper bonding wires. By 2025, the new plant should increase the amount of copper wires that can be made by about 1.5 times. This will help the growth of the semiconductor industry, which uses copper wires.

During the period of the forecast, the wire bonder equipment market is expected to grow at the fastest rate for gold wires. Most of the wire is made of a gold alloy (>90% Au), which has high electrical conductivity and is more resistant to corrosion. Also, the beryllium added to gold alloy helps optimize loop height, temperature strength, elongation at break, and tensile strength. Also, the invention of thermosonic bonding makes it easy to join gold wires together by using pressure and ultrasonic energy. In conclusion, the main things that will speed up the growth of gold wires for bonding during the forecast period are the ones listed above.

• Gold Wire
• Copper Wire
• Aluminum Wire
• Silver Wire

By End-User:

Outsourced Semiconductor Assembly and Testing (OSAT) and Integrated Device Manufacturers are the two types of end-users (IDM). Outsourced semiconductor assembly and testing had the biggest share in 2022, and it is also expected to have the highest CAGR during the forecast period. The growth of OSAT is due to the fact that more and more cutting-edge chips are being made with wedge bonder wires and that the demand for high-end packaging solutions is growing. Also, small and medium chip makers are becoming more dependent on OSAT firms because they don't have enough technological knowledge and resources. This is a big factor in the growth of the market over the next few years. For example, Amkor Technology, a company that assembles and tests semiconductors for other companies, invested in silicon carbide (SC) processing technologies in March 2023 so that it could supply heavy gauge wire bonding to the automotive industry for electrification. So, it is expected that the supply of wire bonders by OSAT providers will drive market growth over the next few years.

• Outsourced Semiconductor Assembly and Testing (OSAT)
• Integrated Device Manufacturers (IDM)

Regional Insights:

The global Thermo Compression Bonder market has been studied in North America, Europe, Asia Pacific, Latin America, and the Middle East and Africa (MEA).

Asia-Pacific is expected to grow the most quickly between 2022 and 2030, with a CAGR of 5.5%. This growth can be explained by the fact that more and more applications need thermo compression bonder. China is expected to stay a major market in the Asia-Pacific area as long as its large manufacturing sector and rapid urbanization keep driving up construction work. India has also grown a lot in the last few years, which is the opposite of what each government's economic policies have done.

Asia Pacific came in second, with a CAGR of 5.7% between 2008 and 2030. This is mostly because of the account recovery seen between 2016 and 2017 after a very bad economic downturn between 2008 and 2009. Even though the European construction industry still faces problems like Brexit, high unemployment, and strict environmental rules, it is expected to grow slowly over the next few years.

• North America
• US
• Canada
• Mexico
• Rest of North America
• Europe
• Germany
• France
• Italy
• Spain
• UK
• Nordic Countries
• Denmark
• Finland
• Iceland
• Sweden
• Norway
• Benelux Union
• Belgium
• The Netherlands
• Luxembourg
• Rest of Europe
• Asia-Pacific
• Japan
• China
• India
• Australia
• South Korea
• Southeast Asia
• Indonesia
• Thailand
• Malaysia
• Singapore
• Rest of Southeast Asia
• Rest of Asia-Pacific
• The Middle East & Africa
• Saudi Arabia
• UAE
• Egypt
• South Africa
• Rest of the Middle East & Africa
• Latin America
• Brazil
• Argentina
• Rest of Latin America

Scope of Report:

Conclusion:

• The report on the thermo compression bonder market gives both qualitative and quantitative information about thermo compression bonders, as well as a detailed analysis of market size and growth rate for all possible market segments.
• Along with this, the report gives a detailed look at how the market works, what new trends are coming up, and how the competition between thermo compression manufacturers is shaping up.
• Key insights from the report include the adoption trends of thermo compression bonder solutions by each market segment, recent industry developments like partnerships, mergers, and acquisitions, business strategies of leading market players, macro- and micro-economic indicators, and key industry trends.